The power efficiency is the ratio of output power and input power. The output power equal to product of VOUT and ILOAD and input power is a product of VIN and IIN. For LDO application, the input current IIN is summing by ILOAD and IGND. If ILOAD is great than IGND, then we can neglect IGND.

The PSRR can be found from data sheet. If PSRR is 60dB@1KHz that indicates the VOUT ripple is one of one thousandth of VIN ripple.
20log X = 60 dB
log X = 3
X=1000
So the ripples will be reduced by 1000 times.

TJ = (θJC * P ) + TC

Thermal of case.
Power loss.
Thermal resistance Junction - case.

2. If boost IC has no OVP function, the maximum output voltage can’t exceed maximum SW pin voltage subtract rectifier forward voltage. The maximum SW pin voltage is listed on the Absolute Maximum Ratings in datasheet.

a) Buck circuit Duty cycle：

b) Buck circuit inductor ：
Choose an inductor to maintain continuous-mode operation down to 10 percent of the rated output load:

ΔIL = 2 x 10% x IO

The inductor value “L“ is ：(when D is from a)


c) Buck circuit COUT：


Choose Cout ，we need to check ESR：


Example：
If：VIN = 12V ；VO = 3.3V；IO = 0.1A~3A；VD = 0.5V；RDS(ON) = 30mΩ；fs = 300K Hz



So Duty cycle is 30.6%

ΔIL = 2 x 10% x IO = 2 x 0.1 x 3A = 0.6A

so choose L >14.8μH.

(ripple is smaller or equal to 50mV)

Choose Cout ，we need to check ESR：

If： VIN(min)=3V；VOUT=12V；IOUT=300mA；fs=300K Hz

so choose L >10μH

Lead-Free Products offered by AME are RoHS-Compliance. RoHS-Compliance means that the part is free of Lead (Pb), Cadmium (Cd), Hexavalent Chromium (Cr+6), Mercury (Hg), PBB's and PBDEs. Since none of our processes or parts use or contain Cadmium, Chromium, Mercury, PBB's and PBDEs, Lead is the only restriction of the use of hazardous substance that applies to our parts. If AME designates a part is Lead-Free, It is also RoHS-compliance.

Our goal is to meet the industry standard for reflow that is mostly defined in
J-STD-020C, which requires a maximum peak of 260°C depending on the component volume. AME suggest reflow profiles should Conform to J-STD-020C

Lead-Free lead frame-based packages are backward compatible. This means that lead frame-based Components with Matte Tin finish can be attached to a PCB using Tin/Lead solder paste with a Tin/Lead solder profile.

All test methods of Tin Whisker are performed according to the Whisker growth condition recommended by National Environmental Methods Index. Before the reliability test, All samples must pass optical microscope visual inspection for initial quality verification to meet AME's specification. After the reliability test, All samples must pass SEM (Scanning Electron Microscope) inspection for Whisker change verification to meet <50 um specification.

100% Matte Tin Plated products undergoes a post Tin plating bake for 1 hour at 150°C within 24 hours of plating. This post plating bake is also referred to as "Annealing" to Inhibit the Whisker growing.